The United States will offer $450 million in proposed federal incentives to SK Hynix for its plan to build a packaging production facility and high-bandwidth memory and progression studios, or HBM, at IndianaArray.
According to the initial memorandum of understanding signed between the two sides, the federal incentive will consist of the South Korean chipmaker’s $3. 87 billion investment to build a complex memory packaging factory for synthetic intelligence products on U. S. soil, the Commerce Department said.
According to Arati Prabhakar, a former Wash100 prize winner and director of the White House Office of Science and Technology Policy, the CHIPS incentives and the Science Act will apply to U. S. computer systems.
He noted that “advanced packaging is increasingly imperative for AI and other next-generation systems. “
SK Hynix will build the production facility at Purdue University Research Park in West Lafayette, Indiana. The company aims to mass-produce HBM from 2028.
Commerce Secretary Gina Raimondo said the federal initiative would bring many new jobs to Indiana and highlight the state’s role in advancing America’s security and national chains.
The operation of the facility will create approximately 1,000 jobs in the region.
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